TSMC Unveils 1.6nm Process Technology With Backside Power Delivery

An anonymous reader quotes a report from Tom’s Hardware: TSMC announced its leading-edge 1.6nm-class process technology today, a new A16 manufacturing process that will be the company’s first Angstrom-class production node and promises to outperform its predecessor, N2P, by a significant margin. The technology’s most important innovation will be its backside power delivery network (BSPDN). Just like TSMC’s 2nm-class nodes (N2, N2P, and N2X), the company’s 1.6nm-class fabrication process will rely on gate-all-around (GAA) nanosheet transistors, but unlike the current and next-generation nodes, this one uses backside power delivery dubbed Super Power Rail. Transistor and BSPDN innovations enable tangible performance and efficiency improvements compared to TSMC’s N2P: the new node promises an up to 10% higher clock rate at the same voltage and a 15%-20% lower power consumption at the same frequency and complexity. In addition, the new technology could enable 7%-10% higher transistor density, depending on the actual design.

The most important innovation of TSMC’s A16 process, which was unveiled at the company’s North American Technology Symposium 2024, is the introduction of the Super Power Rail (SPR), a sophisticated backside power delivery network (BSPDN). This technology is tailored specifically for AI and HPC processors that tend to have both complex signal wiring and dense power delivery networks. Backside power delivery will be implemented into many upcoming process technologies as it allows for an increase in transistor density and improved power delivery, which affects performance. Meanwhile, there are several ways to implement a BSPDN. TSMC’s Super Power Rail plugs the backside power delivery network to each transistor’s source and drain using a special contact that also reduces resistance to get the maximum performance and power efficiency possible. From a production perspective, this is one of the most complex BSPDN implementations and is more complex than Intel’s Power Via. Volume production of A16 is slated for the second half of 2026. “Therefore, actual A16-made products will likely debut in 2027,” notes the report. “This timeline positions A16 to potentially compete with Intel’s 14A node, which will be Intel’s most advanced node at the time.”

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